JLON supplies high-performance polyimide resin powder (PI powder) for demanding thermal, mechanical, electrical, wear and advanced composite applications.
Our PI resin portfolio includes:
Thermosetting Polyimide Resin Powder
for high-temperature molded and precision-machined components.
Thermoplastic Polyimide Resin Powder (TPI Powder)
for applications requiring melt processability, dimensional stability and thermal reprocessing capability.
RTM Polyimide Resin
supplied in powder form and engineered to develop very low melt viscosity during processing for high-temperature fiber-reinforced composites.
Depending on the grade, JLON polyimide powder offers a combination of:
High glass transition temperature
High mechanical strength
Excellent dimensional stability
Low creep
Wear resistance
Chemical resistance
Electrical insulation
Low outgassing
Flame-resistant characteristics
High-temperature performance
JLON PI resin systems can support applications from bearings, bushings, seals, semiconductor parts and EV electrical systems to high-temperature carbon-fiber composite structures.
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Polyimide resin powder is a powdered high-performance polymer or resin system based on polyimide chemistry, designed for manufacturing methods such as compression molding, direct forming, melt processing, compounding or high-temperature composite processing.
Unlike general-purpose polymer powders, PI powder is selected where applications require a demanding combination of:
temperature resistance + mechanical strength + dimensional stability + electrical performance + wear resistance
Different PI powder chemistries behave very differently during processing.
They may be:
Thermosetting
Thermoplastic
Specially formulated for RTM or advanced composite processing
This is why selecting a polyimide powder based only on maximum temperature is not sufficient.
The correct grade should be selected according to:
Operating Temperature + Processing Method + Mechanical Load + Wear Condition + Electrical Requirements + Part Geometry
Fully imidized PI powders are already commercially used for hot compression molding, direct forming and high-performance stock shapes and finished parts.
Polyimide sits at the high-performance end of engineering polymers.
It is often considered when conventional engineering plastics can no longer provide sufficient:
Thermal stability
Creep resistance
Dimensional accuracy
Wear performance
Electrical insulation
Vacuum or low-outgassing performance
Typical application environments include:
Semiconductor manufacturing
Aerospace
Automotive and EV
High-temperature machinery
Pumps and valves
Precision mechanical systems
High-performance composite structures
Commercial PI materials are widely used for bushings, seals, IC test sockets, semiconductor equipment, wear parts, vacuum applications and aerospace components.
Thermosetting polyimide resin powder is designed to undergo irreversible curing during thermal processing.
Once fully cured, the material does not remelt like a thermoplastic.
This makes thermosetting PI particularly suitable for applications requiring:
High-temperature stability
High mechanical strength
Low creep
Dimensional stability
Wear resistance
Electrical insulation
Precision machining after molding
JLON currently offers two thermosetting PI powder grades for different performance requirements.
Thermoplastic polyimide, commonly abbreviated as TPI, combines the high-performance characteristics of polyimide with thermoplastic processability.
Unlike thermosetting PI, TPI does not form a permanent irreversible crosslinked network during melt processing.
Under appropriate conditions, the material can therefore be:
Melt processed
Thermally formed
Reshaped
Reprocessed
Thermoplastic PI is especially attractive where high-temperature performance must be combined with more flexible manufacturing options.
Commercial TPI materials are already used in injection molding, extrusion, semiconductor manufacturing, cable applications, precision machinery, automotive components and wear parts.
RTM polyimide resin is a thermosetting polyimide system optimized specifically for Resin Transfer Molding.
The resin is supplied in powder form, but during processing it develops a very low melt viscosity so that it can flow through and impregnate a fiber preform.
The typical process is:
PI Resin Powder → Melt → Low-Viscosity Flow → Fiber Impregnation → Thermal Cure → High-Temperature Composite
RTM describes the manufacturing route, not a separate fundamental polymer category.
Its main advantage is that it combines:
very low processing viscosity + long processing window + high-temperature performance after cure
| JLON Grade | Resin Type | Main Advantage | Key Thermal Indicator | Typical Processing | Typical Applications |
|---|---|---|---|---|---|
| JLON PI-D1 | Thermosetting PI Powder | Strength, impact performance, wear resistance | Tg 371°C | Compression molding / machining | Bearings, bushings, seals, semiconductor parts |
| JLON PI-D2 | Thermosetting PI Powder | Higher Tg and thermal margin | Tg 406°C | Molding / precision parts | Electronics, machinery, automotive, chip carriers |
| JLON PI-TPI | Thermoplastic PI Powder | Melt processability and dimensional stability | Tg 260°C | Melt processing / forming | EV electrical systems, seals, wear parts |
| JLON PI-RTM | Thermosetting RTM PI | Very low viscosity and long flow window | Long-term >300°C | RTM | High-temperature fiber-reinforced composites |
JLON PI-D1 is a thermosetting polyimide resin powder designed for molded and machined components requiring high mechanical strength, impact performance, wear resistance and dimensional stability.
| Property | Typical Value |
|---|---|
| Density | 1.42 g/cm³ |
| Tensile Strength | ≥100 MPa |
| Elongation at Break | ≥10% |
| Flexural Strength | ≥100 MPa |
| Flexural Modulus | ≥2700 MPa |
| Unnotched Impact Strength | ≥120 kJ/m² |
| Compressive Strength | ≥200 MPa |
| Rockwell Hardness | ≥90 HRE |
| Water Absorption | 0.24% |
| CTE, 23–350°C | 54 ppm/K |
| Glass Transition Temperature, Tg | 371°C |
These values are from the supplied technical data and represent typical results rather than guaranteed specifications.
High tensile strength
High impact performance
High compressive strength
Low creep
Good dimensional stability
Wear resistance
Chemical resistance
Electrical resistance
Low outgassing
Good machinability
Bearings
Bushings
Insulators
Seals
Thrust washers
Wear rings
Wear pads
Wear strips
Pipe clamps
Semiconductor test sockets
Wafer guides
Centrifugal pump wear parts
Chemical and hydrocarbon pump components
The supplied TDS specifically lists bearings, bushings, seals, thrust washers, wear rings, test sockets, wafer guides and pump wear applications.
JLON PI-D2 is a higher-Tg thermosetting polyimide resin powder developed for high-temperature precision mechanical, electrical and electronic applications.
Its typical glass transition temperature reaches: 406°C
This makes the grade particularly suitable where increased thermal margin is required.
| Property | Typical Value |
|---|---|
| Density | 1.42 g/cm³ |
| Tensile Strength | ≥50 MPa |
| Elongation at Break | ≥6% |
| Flexural Strength | ≥100 MPa |
| Flexural Modulus | ≥2500 MPa |
| Unnotched Impact Strength | ≥50 kJ/m² |
| Compressive Strength | ≥200 MPa |
| Rockwell Hardness | ≥90 HRE |
| Water Absorption | 0.30% |
| CTE, 23–350°C | 54 ppm/K |
| Glass Transition Temperature, Tg | 406°C |
Very high Tg
Good toughness
High compressive strength
Good dimensional stability
High-temperature performance
Low water absorption
Good processability
Precision machinery
Industrial machinery
Electrical components
Electronic components
Automotive parts
Transportation equipment
Computer components
Semiconductor chip carriers
High-temperature precision parts
The source TDS lists precision machinery, electrical/electronic components, automotive applications, computer components and semiconductor chip carriers.
JLON PI-TPI is a thermoplastic polyimide powder designed to combine high-performance PI properties with melt processability.
Because it does not form an irreversible chemical crosslinked structure during melt processing, it can be thermally reshaped under suitable conditions.
| Property | Typical Value |
|---|---|
| Density | 1.36 g/cm³ |
| Tensile Strength | ≥100 MPa |
| Elongation at Break | ≥10% |
| Flexural Strength | ≥120 MPa |
| Flexural Modulus | ≥2600 MPa |
| Unnotched Impact Strength | ≥120 kJ/m² |
| Compressive Strength | ≥200 MPa |
| Rockwell Hardness | ≥90 HRE |
| Water Absorption | 0.34% |
| CTE, 23–350°C | 50 ppm/K |
| Glass Transition Temperature, Tg | 260°C |
Melt processability
High dimensional stability
Good flexibility
High mechanical strength
High flexural rigidity
Low coefficient of thermal expansion
Chemical resistance
Radiation resistance
Corona resistance
Electrical insulation
Reprocessability under suitable thermal conditions
EV motor cable components
Motor busbar insulation
Turbocharger seal rings
Transmission seals
High-temperature structural parts
Wear pads
Wear strips
Pipe clamps
Centrifugal pump wear parts
Thermoplastic PI is commercially established in injection molding, extrusion, cable applications, semiconductor manufacturing and automotive components.
JLON PI-RTM is a powder-form thermosetting polyimide resin developed for high-temperature resin transfer molding.
After heating, the resin forms a very low-viscosity melt that can penetrate fiber preforms before thermal curing.
| Property | Typical Performance |
|---|---|
| Supply Form | Powder |
| Melt Viscosity | ≤1.0 Pa·s |
| Low-Viscosity Processing Window | ≥2 hours |
| Long-Term Temperature Capability | >300°C |
| Short-Term Temperature Capability | >500°C |
| Thermal-Oxidative Stability | Excellent |
| Dimensional Stability | Excellent |
| Creep | Low |
| Outgassing | Low |
| Cure Behavior | Stable |
| Small-Molecule Release During Cure | Designed to avoid release |
Low viscosity alone is not enough for RTM.
The resin must remain sufficiently fluid long enough to impregnate the full fiber preform before curing advances too far.
A processing window of ≥2 hours helps support:
Complex geometries
Larger components
More complete fiber wet-out
Reduced risk of dry areas
More stable mold filling
JLON PI-RTM can be evaluated with:
Carbon fiber
Glass fiber
Other high-performance fiber systems
Compatibility and cure conditions should be validated according to the selected reinforcement and component design.
Aerospace composite structures
UAV components
eVTOL structural parts
High-temperature carbon-fiber composites
Lightweight transportation components
High-temperature structural composite parts
| Feature | Thermosetting PI Powder | Thermoplastic PI Powder | RTM PI Resin |
|---|---|---|---|
| Main Polymer Behavior | Irreversibly cured | Melt reprocessable | Thermosetting after RTM |
| Supply Form | Powder | Powder | Powder |
| Can Re-Melt After Processing | No | Yes | No |
| Main Processing Method | Compression molding / direct forming | Melt processing / forming | RTM |
| Critical Processing Property | Cure and final mechanical performance | Melt processability | Very low viscosity and long flow window |
| Typical Products | Bearings, bushings, seals, insulators | Seals, electrical and structural parts | Fiber-reinforced composite structures |
| Main Advantage | High-temperature molded-part performance | Processing flexibility | High-temperature advanced composites |
Different PI powder systems require very different processing routes.
Typical methods include:
Compression molding
Direct forming
Sintering
Melt processing
Injection molding
Extrusion
RTM
Machining after molding
Commercial PI molding powders are already widely used for hot compression molding, direct forming and finished high-performance parts.
Thermoplastic PI systems, by contrast, can support injection molding and extrusion where conventional non-meltable PI systems cannot.
For this reason, processing method should always be confirmed before grade selection.
High-temperature tribological components are one of the most established applications for PI powder.
Typical components include:
Bearings
Bushings
Thrust washers
Seal rings
Wear rings
Wear pads
Sliding components
Pump parts
PI is attractive in these applications because selected grades can combine:
temperature resistance + low creep + dimensional stability + wear resistance + mechanical strength
Filled PI powders can also be used where lower friction or higher wear resistance is required.
Commercial suppliers already offer graphite-filled PI molding powders specifically for bearings and bushings.
Semiconductor manufacturing equipment often requires polymers with:
High dimensional stability
Heat resistance
Low outgassing
Low contamination
Electrical performance
Precision machining capability
Typical PI components include:
Test sockets
Wafer guides
Chip carriers
Electrical insulators
Precision fixtures
Handling components
Polyimide is already widely used in semiconductor production equipment and IC test applications.
Thermoplastic PI is particularly relevant to automotive and EV systems where thermal, electrical and mechanical performance must be combined.
Typical applications include:
EV motor insulation
Motor busbar components
High-temperature electrical parts
Turbocharger seal rings
Transmission seals
Wear components
Precision drivetrain components
Commercial thermoplastic PI materials are used in automotive, electrical, cable and precision machinery applications because of their high thermal stability and melt processability.
Different PI technologies serve different aerospace requirements.
Suitable for:
High-temperature molded components
Wear parts
Precision mechanical components
Insulators
Suitable where:
Melt processing
Re-formability
Toughness
Electrical insulation
are important.
Suitable for:
Carbon-fiber structures
High-temperature composite components
UAV structures
Aerospace lightweight structures
RTM PI is especially valuable where a resin must first flow through a fiber preform and then deliver high thermal capability after cure.
JLON can also support downstream PI shapes and custom components.
Typical products include:
Polyimide tube
Polyimide rod
Polyimide ring
Polyimide bushing
Polyimide bearing
Polyimide seal
Polyimide insulator
Wear parts
Custom machined PI components
The typical production route is:
Polyimide Powder → Molding → Stock Shape → Precision Machining → Finished Part
Explore Polyimide Parts & Shapes →
You need:
Compression molding
High-temperature molded parts
Wear resistance
Low creep
Precision machining
High dimensional stability
Typical parts:
Bearings · Bushings · Seals · Wear Rings · Insulators · Semiconductor Parts
You need:
Melt processing
Thermal reshaping
Injection molding or extrusion potential
Electrical insulation
Automotive or EV applications
More flexible processing
Typical parts:
Electrical Components · Seals · Structural Parts · Wear Components
You need:
Fiber impregnation
Very low melt viscosity
Long processing window
High-temperature composite structures
Typical applications:
Carbon Fiber Aerospace Components · UAV Structures · Advanced High-Temperature Composites
JLON supplies different PI powder systems for different manufacturing routes rather than offering one generic high-temperature polymer for every application.
We can support customers with:
Polyimide powder grade selection
Thermosetting PI powder
Thermoplastic PI powder
RTM PI resin
Technical data
Sample evaluation
Application analysis
Processing discussion
Polyimide stock shapes
Machined PI components
International supply support
Our objective is to match the PI chemistry and processing route to the customer's real application rather than selecting material based only on a maximum temperature figure.
Polyimide powder is a powdered form of polyimide polymer or PI resin system used for manufacturing high-performance molded, formed or composite components.
Depending on chemistry, PI powder may be thermosetting, thermoplastic or formulated for specialized processes such as RTM.
Polyimide resin powder can be used for:
Compression molding
Direct forming
High-temperature bearings and bushings
Seals and wear parts
Semiconductor components
Electrical insulation
Thermoplastic processing
High-temperature composite manufacturing
The appropriate use depends on the resin chemistry and processing route.
Thermosetting PI powder undergoes irreversible curing during thermal processing.
Once fully cured, it cannot be remelted and reshaped like a thermoplastic.
It is commonly selected for high-temperature molded parts requiring mechanical strength, low creep and dimensional stability.
Thermoplastic PI powder, or TPI powder, is designed for melt processing.
It does not form an irreversible crosslinked structure during melt processing and can therefore be thermally reprocessed under suitable conditions.
JLON RTM polyimide resin is supplied in powder form.
During heating, it develops a low-viscosity melt suitable for impregnating fiber preforms before thermal curing.
RTM polyimide resin is a thermosetting PI system optimized for Resin Transfer Molding.
RTM describes the processing route rather than a separate polymer category.
Yes.
Polyimide molding powder is widely used for high-temperature bearings, bushings, thrust washers, wear rings and related sliding components.
Yes.
Typical applications include:
Test sockets
Wafer guides
Insulators
Chip carriers
Precision handling parts
Yes, when an appropriate matrix resin is selected.
RTM PI resin is particularly suitable where the resin must first impregnate a carbon-fiber preform and then cure into a high-temperature composite matrix.
Yes.
JLON can support both PI resin powder and downstream polyimide components, including:
Tubes
Rods
Rings
Bushings
Bearings
Seals
Insulation parts
Custom machined parts
