JLON supplies high-temperature release films made from ETFE (ethylene tetrafluoroethylene) and FEP (fluorinated ethylene propylene) for composite manufacturing processes requiring elevated curing temperatures.
These fluoropolymer release films are designed to separate composite laminates from processing consumables during autoclave curing, vacuum bagging, compression molding and other high-temperature manufacturing operations.
Our product range includes two grades: JL-RF230, an ETFE-based release film with a recommended working temperature up to 210°C, and JL-RF260, an FEP-based release film with a recommended working temperature up to 240°C, subject to validation of the specific curing conditions.
Both grades are available in perforated and non-perforated configurations, with a nominal thickness of 25 μm and available widths up to 3.4 m, depending on production specifications.
JLON offers two fluoropolymer release film grades for composite processes requiring higher temperature resistance than standard PE or PP-based release films.
Property | JL-RF230 | JL-RF260 |
Base Polymer | ETFE | FEP |
Grade Designation | 230°C | 260°C |
Recommended Working Temperature* | Up to 210°C | Up to 240°C |
Nominal Thickness | 25 μm | 25 μm |
Thickness Tolerance | ±5 μm | ±5 μm |
Available Types | Perforated / Non-perforated | Perforated / Non-perforated |
Available Width | Up to 3.4 m | Up to 3.4 m |
Typical Processes | Autoclave curing, vacuum bagging, composite molding | Higher-temperature autoclave curing, press curing, composite molding |
Typical Resin Systems | Epoxy and other compatible thermoset resins | Epoxy and other compatible high-temperature resin systems |
The recommended working temperatures are supplier-provided selection values and require confirmation under the actual curing cycle. Grade designations do not represent unrestricted continuous service temperatures.
ETFE and FEP fluoropolymer films provide release properties for composite processing at elevated temperatures.
Their low surface energy helps reduce adhesion between the cured resin and the release film, facilitating removal after the curing cycle.
Both grades are available in perforated and non-perforated configurations to support different resin management and processing requirements.
Perforated films allow resin and gases to pass through defined openings, while non-perforated films provide a continuous barrier to resin flow.
Thin fluoropolymer films can conform to various composite surface geometries.
The actual conformability depends on film thickness, mechanical properties, temperature and component geometry.
Release films with widths up to 3.4 m can be discussed for large composite components.
Wider films can reduce the number of seams required during lay-up, particularly for large molds and industrial composite structures.
ETFE and FEP release films can be evaluated for autoclave curing, vacuum bagging, prepreg processing and selected compression molding applications.
Compatibility should be confirmed for the specific resin system and manufacturing conditions.
ETFE and FEP are fluoropolymers commonly used for high-temperature release applications.
Both materials offer low surface energy and chemical resistance, but they differ in mechanical properties, thermal characteristics and processing behavior.
Selecting the appropriate film requires consideration of the complete curing cycle rather than temperature alone.
ETFE release film combines release performance with relatively high mechanical strength and toughness.
These properties can be useful when handling thin films over curved surfaces or complex composite geometries.
JL-RF230 is intended for elevated-temperature composite curing processes where a flexible, mechanically robust release layer is required.
The supplier recommends a working temperature up to 210°C, subject to verification under the actual process conditions.
Mechanical Strength
ETFE generally offers relatively high tensile strength among common fluoropolymer films, although performance depends on the specific film formulation and manufacturing process.
Toughness and Handling
Its mechanical characteristics can help reduce handling damage during lay-up and film removal.
Conformability
Thin ETFE film can be suitable for curved composite surfaces, depending on elongation properties and film thickness.
Composite Processing Applications
ETFE release film is used in selected epoxy prepreg curing, autoclave molding and other high-temperature composite manufacturing processes.
FEP release film provides low surface energy, chemical resistance and thermal performance for elevated-temperature composite processing.
JL-RF260 is intended for applications requiring a higher recommended working temperature than JL-RF230.
The supplier recommends a working temperature up to 240°C, subject to validation of temperature exposure, curing duration and process conditions.
Higher Recommended Processing Temperature
JL-RF260 offers a higher supplier-recommended working temperature than JL-RF230, making it a candidate for selected high-temperature curing processes.
Release Performance
FEP provides a low-energy surface that can facilitate separation from many cured composite resin systems.
Flexible Film Structure
FEP films can offer flexibility and conformability suitable for composite molding, depending on the individual grade.
Chemical Resistance
FEP offers resistance to many chemicals and can be suitable for a variety of composite processing environments.
Property | ETFE — JL-RF230 | FEP — JL-RF260 |
Base Polymer | Ethylene Tetrafluoroethylene | Fluorinated Ethylene Propylene |
Nominal Thickness | 25 ± 5 μm | 25 ± 5 μm |
Recommended Working Temperature | Up to 210°C* | Up to 240°C* |
Release Characteristics | Low surface energy | Low surface energy |
Mechanical Behavior | Generally relatively high strength and toughness | Flexible, with properties dependent on grade |
Conformability | Suitable for selected complex geometries | Suitable for selected complex geometries |
Perforated Option | Available | Available |
Non-Perforated Option | Available | Available |
Typical Applications | Autoclave curing, prepreg processing | Higher-temperature curing, composite molding |
Working temperatures are based on the supplied product information and must be verified for the specific process.
The supplier has provided the following test values for an ETFE production sample.
Property | Reported Test Result |
Tensile Strength, Machine Direction (MD) | 39.8 MPa |
Tensile Strength, Transverse Direction (TD) | 35.2 MPa |
Elongation at Break, MD | 285% |
Elongation at Break, TD | 452% |
These figures represent supplier-reported test results rather than guaranteed specification limits. Test methods, sample conditions and production tolerances should be confirmed in the final technical datasheet.
Determine the peak temperature reached by the composite laminate, including curing exotherm and any local temperature variation.
The temperature experienced by the film may differ from the oven or autoclave set point.
For composite components with complex shapes, tight radii or demanding film-handling conditions, compare the tensile strength, elongation and tear resistance of the available film grades.
ETFE may be preferred where mechanical toughness is an important selection factor, but the final decision should be based on product-specific data.
The film must provide suitable release behavior with the selected epoxy, phenolic, BMI or other resin formulation.
Compatibility should be evaluated under the actual curing cycle, including temperature, pressure and curing duration.
Release film is only one component of the composite processing stack.
Vacuum bagging film, sealant tape, breather materials, bleeder materials and other consumables must also be suitable for the specified temperature and pressure conditions.
Both ETFE and FEP release films are available in perforated and non-perforated versions.
The correct choice depends primarily on resin management requirements and the processing configuration.
Perforated release film contains controlled openings that allow resin and gases to pass through the film.
In selected prepreg curing processes, perforated film may be used together with bleeder materials to remove a controlled amount of excess resin.
Perforation geometry, resin viscosity, cure temperature, pressure and bleeder capacity all influence resin removal.
Because autoclave processing can involve elevated consolidation pressures, perforation selection should follow the resin system manufacturer's processing recommendations.
Non-perforated release film provides a continuous barrier to resin flow through the film.
It is commonly selected for processes requiring resin retention, including certain no-bleed prepreg systems.
The film can help separate the laminate from other consumables without allowing resin to pass directly through the film.
However, adequate air and volatile evacuation paths must be maintained according to the process design.
Feature | Perforated Film | Non-Perforated Film |
Film Structure | Film with controlled openings | Continuous film |
Resin Passage | Through perforations | Blocked through the film |
Gas Passage | Possible through perforations | Alternative evacuation paths required |
Resin Management | Supports controlled resin bleed | Supports resin retention |
Typical Applications | Controlled-bleed prepreg, selected high-temperature lay-ups | No-bleed prepreg, resin-retention applications |
Potential Risk | Excessive resin removal | Entrapped air or volatiles |
Surface Characteristics | Perforation marks may occur | No perforation pattern transferred |
Technical Note
Perforated film is not automatically required for high-temperature curing, and non-perforated film is not always preferable for autoclave processes.
The appropriate film must be selected according to the prepreg formulation, resin bleed requirements and approved manufacturing procedure.
High-temperature release films are used in selected aerospace and UAV composite manufacturing processes involving carbon fiber and fiberglass reinforced resin systems.
ETFE and FEP films can serve as separation layers during vacuum bagging and autoclave curing, where compatibility with the cure cycle has been established.
Composite Skins and Panels
Release films can be used during the curing of carbon fiber and fiberglass skins to separate the laminate from processing consumables.
Wing and Control Surface Components
Selected high-temperature release films may be incorporated into prepreg processing for wings, control surfaces and other structural composite components.
Composite Ribs and Spars
Release films can support the processing of complex composite structures, provided the film is compatible with the approved cure cycle and laminate design.
For aerospace applications, material qualification and compliance with the customer's manufacturing specifications are essential.
High-temperature release film is used during composite curing processes that involve elevated temperature and consolidation pressure.
The film helps prevent bonding between the composite laminate and selected processing materials.
ETFE and FEP release films can be selected for suitable high-temperature autoclave processes.
The film must withstand the required curing temperature, pressure, duration and resin exposure.
Release films may be used in selected compression molding and press-curing applications where a removable separation layer is required.
Suitability depends on the molding temperature, pressure, tooling geometry and resin system.
High-temperature release films can be used in the production of selected carbon fiber composite automotive components.
Typical applications include vacuum-bagged or press-cured composite panels, structural components and other high-performance parts.
Film selection depends on the component geometry, surface requirements and curing process.
ETFE and FEP release films can be used as temporary separation layers in selected tooling and molding operations.
Their low surface energy helps facilitate removal from compatible cured resin surfaces.
For applications requiring repeated use, the release film should be evaluated for durability and suitability. Standard thin release films are generally intended as consumables rather than permanent reusable tooling surfaces.
ETFE and FEP release films may be evaluated with selected high-temperature thermoset resin systems.
Possible applications include certain epoxy, phenolic, BMI and other specialized composite resin formulations.
The required curing temperature and chemical compatibility should be confirmed before use.
For thermoplastic composites, the film must be evaluated against the actual processing temperature and pressure. Many high-performance thermoplastics require processing temperatures above the recommended limits of JL-RF230 and JL-RF260.
The following table summarizes the supplier-provided product information for the two high-temperature release film grades.
Property | Test Method | JL-RF230 | JL-RF260 |
Base Polymer | — | ETFE | FEP |
Nominal Thickness | Supplier Specification | 25 μm | 25 μm |
Thickness Tolerance | Supplier Specification | ±5 μm | ±5 μm |
Grade Designation | — | 230°C | 260°C |
Recommended Working Temperature | Supplier Recommendation | ≤210°C | ≤240°C |
Tensile Strength, MD | Test method to confirm | 39.8 MPa* | To be confirmed |
Tensile Strength, TD | Test method to confirm | 35.2 MPa* | To be confirmed |
Elongation at Break, MD | Test method to confirm | 285%* | To be confirmed |
Elongation at Break, TD | Test method to confirm | 452%* | To be confirmed |
Perforated Version | — | Available | Available |
Non-Perforated Version | — | Available | Available |
Maximum Available Width | Supplier Specification | Up to 3.4 m | Up to 3.4 m |
ETFE mechanical values are supplier-reported test results, not guaranteed specification limits.
The recommended working temperatures refer to supplier-provided composite processing guidance, not unrestricted continuous service temperatures.
Actual suitability depends on curing duration, pressure, temperature distribution and resin compatibility.
Mechanical values may vary with film formulation, manufacturing direction, thickness and test conditions.
Final specification limits should be confirmed through the relevant technical datasheets.
Different perforation patterns may be available for both ETFE and FEP films.
Hole diameter, spacing and distribution should be specified according to the required resin bleed or gas evacuation characteristics.
Standard and custom roll widths are subject to production availability.
Please confirm the required film thickness, width, roll length and quantity before ordering.
Selecting the appropriate film requires consideration of curing temperature, resin compatibility, film permeability and processing conditions.
The selected release film must be suitable for the highest temperature reached during the curing process.
This includes possible resin exotherm, local temperature variation and the duration of exposure.
Processing Temperature | Suggested Release Film |
Up to 130°C | JL-RF130 Standard Release Film |
Above 130°C to 160°C | JL-RF160 Standard Release Film |
Above 160°C to 210°C | JL-RF230 ETFE Release Film |
Above 210°C to 240°C | JL-RF260 FEP Release Film |
Above 240°C | Request an alternative high-temperature release solution |
These are preliminary selection ranges based on the supplier's recommended values. The selected film must be validated for the actual process, especially near the stated temperature limit.
JL-RF230 is a candidate for elevated-temperature processes where mechanical toughness, handling strength and flexibility are important.
JL-RF260 is a candidate for processes requiring the higher supplier-recommended working temperature.
FEP may also be selected for its release characteristics and compatibility with specific resin systems.
Select perforated film when the manufacturing process requires resin bleed or resin passage through the release layer.
The perforation arrangement should be matched to the resin system and processing conditions.
Select non-perforated film when a continuous resin barrier or resin-retention layer is required.
Ensure appropriate evacuation paths are available for trapped air and volatiles.
Specify whether the process uses epoxy, phenolic, BMI or another resin formulation.
Provide the maximum expected laminate temperature and the time spent at elevated temperature.
Confirm the applicable pressure conditions and curing method.
Specify the required thickness, width, length and perforation pattern.
JLON supplies both standard-temperature and high-temperature release films for different composite manufacturing requirements.
Property | Standard Release Film | High-Temperature Release Film |
Main Materials | Modified PE, PP/PE/PA6 | ETFE, FEP |
JLON Grades | JL-RF130, JL-RF160 | JL-RF230, JL-RF260 |
Recommended Temperature Range | Up to 130°C or 160°C, depending on grade | Up to 210°C or 240°C, subject to validation |
Perforated Option | Available | Available |
Non-Perforated Option | Available | Available |
Typical Processes | Vacuum bagging, wet lay-up, selected infusion and prepreg processes | High-temperature vacuum bagging, autoclave and press curing |
Material Selection | For standard composite curing requirements | For processes requiring fluoropolymer release performance |
For processes below 160°C, standard PE or PP-based release films may provide a more economical option when they meet the technical requirements.
For higher-temperature processes, ETFE or FEP release films can be evaluated based on the required curing cycle and resin compatibility.
High-temperature release film is used to separate composite laminates from processing consumables during elevated-temperature curing and molding operations.
ETFE and FEP films are commonly considered for autoclave curing, vacuum bagging, prepreg processing and selected compression molding applications.
ETFE and FEP are different fluoropolymers with distinct mechanical and thermal characteristics.
ETFE generally offers relatively high mechanical strength and toughness, while FEP is valued for its release characteristics, chemical resistance and thermal performance.
The appropriate choice depends on the specific film grade, resin system and curing conditions.
JL-RF230 is designated as a 230°C-grade ETFE release film.
The supplier recommends a working temperature up to 210°C for the intended composite processing applications.
This recommendation is not an unrestricted continuous service rating. Actual suitability depends on temperature exposure, curing duration and processing conditions.
JL-RF260 is designated as a 260°C-grade FEP release film.
The supplier recommends a working temperature up to 240°C for selected composite manufacturing processes.
Actual suitability should be validated under the required cure cycle, particularly when operating close to the recommended temperature limit.
JL-RF230 may be considered for a 180°C epoxy prepreg curing process, subject to confirmation of resin compatibility, maximum laminate temperature, cure duration and other processing conditions.
The selection of perforated or non-perforated film should follow the prepreg manufacturer's recommended curing procedure.
Yes, perforated release film can be used in autoclave processes designed for controlled resin bleed or gas evacuation through the film.
However, not all autoclave processes require perforated film. No-bleed prepreg systems may use non-perforated release film with appropriate evacuation paths.
Thin release films used in composite curing are generally intended as single-use consumables.
Reuse is not recommended unless the specific product and manufacturing procedure have been validated for repeated use.
Repeated handling and thermal exposure may affect film integrity and release performance.
ETFE and FEP are fluoropolymers that provide inherent release properties through their low surface energy.
However, the absence of silicone coatings or other surface treatments must be confirmed for the specific product grade.
For components requiring secondary bonding or painting, follow the approved surface preparation procedure rather than assuming that no cleaning or treatment is necessary.
ETFE or FEP may be suitable alternatives to PTFE for certain composite processing applications.
However, the substitution depends on curing temperature, resin compatibility, release performance and processing requirements.
PTFE and other specialized release materials may be required for more demanding high-temperature applications.
JL-RF230 and JL-RF260 are offered with a nominal thickness of 25 μm and a supplier-stated width capability of up to 3.4 m.
Actual available widths, roll lengths and production quantities should be confirmed before ordering.
Yes. Contact JLON with your required film grade, curing temperature, resin system, perforation type and roll dimensions.
Our team can discuss available technical specifications, samples and product suitability for your composite manufacturing process.
